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INSTET

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About INSTET project

Grant Agreement ID: 811509.
Program: H2020-EU.3. – PRIORITY ‘Societal challenges; H2020-EU.2.3. – INDUSTRIAL LEADERSHIP – Innovation In SMEs;H2020-EU.2.1. – INDUSTRIAL LEADERSHIP – Leadership in enabling and industrial technologies.
Topic: EIC-SMEInst-2018-2020 – SME instrument.
Period: 1 June 2018 – 31 May 2020.
Description: Intrinsic ID is working on INSTET – a fully-fledged security solution on top of PUF that will protect low-end chips that are omnipresent in IoT devices everywhere by making them physically & cryptographically secure and very resilient to advanced attacks. INSTET will work as a Root of Trust—a set of core software components that are always trusted by the chip, and provide a trust foundation for the IoT device & distributed IoT systems.
Website links: INSTET EC website

Participants: Intrinsic ID B.V.

Intrinsic ID’s development and deployment of unique microchip fingerprint technology for new markets, supported by INSTET, is summarized in the video below

Technical challenge and innovation approach

INSTET Challenge – IoT as the Internet of Trouble

Botnets (networks of computers infected and repurposed for malicious activities) have existed for at least a decade. As early as 2000, hackers were breaking into computers all over the Internet and controlling them at large. Among other things, hackers used the combined computing power of these botnets to launch distributed denial-of-service (DDoS) attacks, which flood websiteswith traffic to take them down. But today the problem is getting worse, because of the abundance of cheap webcams, digital video recorders, baby monitors, smart thermostats, air quality sensors, and other gadgets in the Internet of Things (IoT). The arrival of IoT means that computers are now baked into everything from road signs & MRI scanners to prosthetics & insulin pumps. Because these devices typically have little or no security, hackers can take them over with little effort. And that makes it easier than ever to build huge botnets that can do much more damage than taking down one website at a time.

INSTET Innovation – the only solution to secure the chips that are already deployed in the field

INSTET is a novel solution to protect from attacks low-end IoT chips manufactured in high volumes. It is based on our patented technology called physical unclonable function (PUF), which a) makes microchips uniquely identifiable & b) enables reliable generation of random numbers, which allows us to generate secure cryptographic keys. Our PUF is already successfully used by major global semiconductor vendors. INSTET expands these features further into a fully-fledged Root of Trust – a set of core software components that convert almost any low-end IoT chip into a physically & cryptographically secure module which can be trusted by other devices in an IoT network. INSTET is the only solution that can add a security layer to cost- & size-constrained chips without any hardware design changes.

During our SME Instrument Phase 1 we calculated 25-30% cost savings on implementing security for a typical IoT device. Uniquely, INSTET can be applied not only to newly designed chips, but to the existing ones, drastically increasing the security of individual IoT devices & IoT systems that are currently deployed in the field.

 

Project structure

The project is divided in seven main work packages:

    • WP1 – Security services definition and platform selection
    • WP2 – Components development for IoT
    • WP3 – Security architecture & backend development
    • WP4 – Integration, tests & trials
    • WP5 – Business development
    • WP6 – Communication & Dissemination
    • WP7 – Project Management

Deliverables

Submitted deliverables:

WP NoDel Rel. NoTitleDissemination LevelStatus
WP1D1.1Security services definition & IoT node selection for wearables reportCOSubmitted
WP1D1.2Security services definition & IoT node selection for medical reportCOSubmitted
WP1D1.3Security services definition & IoT node selection for critical infrastructure reportCOSubmitted
WP1D1.4Report on methodology for customized design and fast integrationCOSubmitted
WP1D7.1Project quality handbookCOSubmitted
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