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PRIME

Grant Agreement ID: 692519.
Program: H2020-EU.2.1.1.7. – ECSEL
Topic: ECSEL-06-2015 – Semiconductor Process, Equipment and Materials.
Period: 1 April 2016 – 31 March 2019.
Description: The goal of the PRIME project is to establish an open Ultra Low Power (ULP) Technology Platform
containing all necessary design and architecture blocks and components which could enable the European industry to increase and strengthen their competitive and leading eco-system and benefit from market opportunities created by the Internet of Things (IoT) revolution.
Website links: PRIME website, PRIME EC website

Participants: INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM, BUBBLES AND BEYOND GMBH, CEZAMAT PW SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA,DREAM CHIP TECHNOLOGIES GMBH, FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V., GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, IDT EUROPE GMBH, INTRINSIC ID B.V., SOITEC SA, STICHTING IMEC NEDERLAND, STMICROELECTRONICS ROUSSET SAS, STMICROELECTRONICS S.A. SURECORE LTD, SYNOPSYS NETHERLANDS BV, Singulus Technologies AG, TECHNISCHE UNIVERSITAET DRESDEN,
TECHNOLUTION BV.

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