Intrinsic ID works with prominent technology partners to overcome some of today’s most challenging security problems with innovative and reliable products and solutions.
Amazon Web Services
An Advanced tier Technology Partner in the Amazon Web Services (AWS) Partner Network. Recognized for ability to deliver unclonable device identities, a requirement AWS has stated as critical to its cloud services.
Intrinsic ID is a member of the Arm Partnership program and has ported its IP on various Arm cores.
Joint work to provide cost-effective provisioning of unique, certified device identities rooted in hardware that can be adapted to any existing manufacturing workflow. Read how our joint solution is applied to a LoRa asset tracking use case.
Jointly developing customer security solutions leveraging Intrinsic ID’s SRAM PUF-based key management system and Guardtime’s KSI Blockchain.
New use cases in the Internet of Things, e.g with connected medical devices are developed together with Intrinsic ID‘s SRAM PUF technology for key storage and authentication.
Irdeto’s digital platform security protects platforms and applications for media & entertainment, games, connected transport and IoT connected industries.
Silex Insight (previously Barco Silex) and Intrinsic ID partner to enable the use of Intrinsic ID‘s BroadKey or QuiddKey with Silex Insight’s eSECURE.
Intrinsic ID is a member of the Synopsys ARC Access Program and has ported authentication software to the ARC processors from Synopsys.
Trustonic is a leader in the device security market, with a mission to protect, enrich and simplify people’s digital lives by enabling optimum security on all smart connected devices.
Intrinsic ID is a partner of the TSMC Soft IP Alliance Program and the companies are evaluating SRAM PUF Technology for new nodes/processes.
Global Semiconductor Alliance
GSA’s mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective ecosystem through collaboration, integration and innovation.